JPH01115603A - ウエハの切断方法 - Google Patents

ウエハの切断方法

Info

Publication number
JPH01115603A
JPH01115603A JP62274536A JP27453687A JPH01115603A JP H01115603 A JPH01115603 A JP H01115603A JP 62274536 A JP62274536 A JP 62274536A JP 27453687 A JP27453687 A JP 27453687A JP H01115603 A JPH01115603 A JP H01115603A
Authority
JP
Japan
Prior art keywords
ingot
cut
wafer
columnar material
hone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62274536A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0471687B2 (en]
Inventor
Katsuo Honda
本田　勝男
Susumu Sawafuji
進 沢藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Priority to JP62274536A priority Critical patent/JPH01115603A/ja
Priority to EP88101301A priority patent/EP0313714B1/en
Priority to EP19920119722 priority patent/EP0534499A3/en
Priority to DE88101301T priority patent/DE3884903T2/de
Priority to US07/150,376 priority patent/US4852304A/en
Priority to KR1019880001384A priority patent/KR930001284B1/ko
Priority to US07/344,956 priority patent/US4894956A/en
Publication of JPH01115603A publication Critical patent/JPH01115603A/ja
Publication of JPH0471687B2 publication Critical patent/JPH0471687B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/003—Multipurpose machines; Equipment therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mining & Mineral Resources (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP62274536A 1987-10-29 1987-10-29 ウエハの切断方法 Granted JPH01115603A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP62274536A JPH01115603A (ja) 1987-10-29 1987-10-29 ウエハの切断方法
EP88101301A EP0313714B1 (en) 1987-10-29 1988-01-29 Apparatus and method for slicing a wafer
EP19920119722 EP0534499A3 (en) 1987-10-29 1988-01-29 Method for slicing a wafer
DE88101301T DE3884903T2 (de) 1987-10-29 1988-01-29 Vorrichtung und Verfahren zum Abschneiden einer Halbleiterscheibe.
US07/150,376 US4852304A (en) 1987-10-29 1988-01-29 Apparatus and method for slicing a wafer
KR1019880001384A KR930001284B1 (ko) 1987-10-29 1988-02-13 웨이퍼 절단장치 및 그 방법
US07/344,956 US4894956A (en) 1987-10-29 1989-04-28 Apparatus and method for slicing a wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62274536A JPH01115603A (ja) 1987-10-29 1987-10-29 ウエハの切断方法

Publications (2)

Publication Number Publication Date
JPH01115603A true JPH01115603A (ja) 1989-05-08
JPH0471687B2 JPH0471687B2 (en]) 1992-11-16

Family

ID=17543075

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62274536A Granted JPH01115603A (ja) 1987-10-29 1987-10-29 ウエハの切断方法

Country Status (1)

Country Link
JP (1) JPH01115603A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114211260A (zh) * 2021-12-16 2022-03-22 南京铭胜建设工程有限公司 一种建筑用切割打磨一体化设备

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114211260A (zh) * 2021-12-16 2022-03-22 南京铭胜建设工程有限公司 一种建筑用切割打磨一体化设备

Also Published As

Publication number Publication date
JPH0471687B2 (en]) 1992-11-16

Similar Documents

Publication Publication Date Title
JP4986568B2 (ja) ウエーハの研削加工方法
KR930001284B1 (ko) 웨이퍼 절단장치 및 그 방법
US4344260A (en) Method for precision shaping of wafer materials
JP5254539B2 (ja) ウエーハ研削装置
US7462094B2 (en) Wafer grinding method
JP5147417B2 (ja) ウェーハの研磨方法および研磨装置
CN109290876A (zh) 晶片的加工方法
JP7413103B2 (ja) ウェーハの研削方法
US20060009134A1 (en) Grinding wheel, grinding apparatus and grinding method
JPS6312741B2 (en])
JP7128309B2 (ja) 面取り基板の製造方法及びそれに用いられる面取り装置
JPH07323420A (ja) ウェーハ製造方法及びその装置
JP7347967B2 (ja) 研削方法
JP2003236736A (ja) 平面研削方法
JPH01115603A (ja) ウエハの切断方法
JP2737783B2 (ja) ウエハの切断装置
JP2015006709A (ja) ウエーハの研削方法及び研削装置
JPH0471688B2 (en])
JP7658729B2 (ja) 原始ウエーハの加工方法
US12358099B2 (en) Dressing ring
JP7525268B2 (ja) 平面研削装置
JPH02185359A (ja) 研削方法及びその装置
JPS63288654A (ja) 半導体ウェ−ハの研削方法及び装置
JP2007021586A (ja) 面取り用砥石のツルーイング方法
JPH0355168A (ja) 平面研削加工機のカップ型砥石

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees